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High End Sensors 2018 International Conference

10th-11th April 2018, Brussels, Belgium

THREE cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe

Registration at one conference allows access to other conference sessions

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Speakers Include

Fraunhofer IOSB
Wilmuth Muller
University of Manchester
Mohamed Missous
Fibos
Nicholas Burgwin
BAE Systems
Henry White
IFSA
Sergey Yurish
Jaguar Land Rover
Nigel Clarke
VIDaP
Iwan Davies
Evatec
Speaker TBC
Infineon
Bernhard Straub
Ilika Technologies
Denis Pasero
CEA-Leti
Sergio Nicoletti
CEA-Leti
Pierre-Damien Berger
Aryballe Technologies
Tristan Rousselle
Tyndall National Institute
Peter O'Brien
Sigma Designs
Johan Pedersen
AMS AG
Rainer Minixhofer
IST AG
Diego Reyes
IHS Markit
Richard Dixon
imec
Nora Maene
Technobis
Pim Kat

SPEAKERS INCLUDE

Wilmuth Muller, Fraunhofer IOSB
Mohamed Missous, University of Manchester
Nicholas Burgwin, Fibos
Henry White, BAE Systems
Sergey Yurish, International Frequency Sensor Association

Nigel Clarke, Jaguar Land Rover
Iwan Davies, VIDaP Consortium
Speaker TBC, Evatec
Bernhard Straub, Infineon Technologies
Denis Pasero, Ilika Technologies

Sergio Nicoletti, CEA-Leti: MIRPHAB
Pierre-Damien Berger, CEA-Leti
Tristan Rousselle, Aryballe Technologies
Peter O'Brien, Tyndall National Institute
Johan Pedersen, Sigma Designs

Rainer Minixhofer, AMS AG
Diego Reyes, Innovative Sensor Technology
Richard Dixon, IHS Markit
Nora Maene, imec
Pim Kat, Technobis

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High-End Sensors: Market Opportunities

10th-11th April 2018, Brussels, Belgium

Co-located with the CS International and PIC International

2 days, 10 topics

High-End Sensors: Market Opportunities

10th-11th April, 2018, sheraton brussels airport hotel, Belgium

TEN IN-DEPTH CONFERENCE TOPICS

The presentations will be covering ten key topics which collectively provide complete coverage for High-End Sensors: Market Opportunities.


Speakers Include

Rainer Minixhofer
Tristan Rousselle
Henry White
Pierre-Damien Berger
Sergio Nicoletti
Speaker TBC
Nicholas Burgwin
Richard Dixon
Denis Pasero
Nora Maene
Bernhard Straub
Diego Reyes
Sergey Yurish
Nigel Clarke
Johan Pedersen
Pim Kat
Peter O'Brien
Mohamed Missous
Iwan Davies
Iñigo Artundo

3 Conferences, 2 Days, 1 Exhibition

HES International

High-end sensor devices are an increasingly significant share of the global machine sensory market that is expected to exceed 30 billion devices by 2020 with revenue of (USD) $20 billion. We will explore opportunities for the most advanced sensors that deliver higher performance, ruggedness and longer operational lifetimes. We will examine new technologies that are cutting costs while increasing effectiveness. We will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency.

Compound Semiconductor International

The 8th CS International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning five sectors.

Together, these talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs.

Attendees at this two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Photonic Integrated Circuits International

Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by organising the 3nd PIC International, a global conference dedicated to this industry.

Attendees to the conference will hear industry-leading insiders delivering more than 30 presentations spanning five sectors. The conference will equip the delegates with an up-to-date overview of the status of the PIC industry, and provided them with many opportunities to meet other key players within this community.

3/2/1
THREE cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe.

Access to 3
Registration at one conference allows access to all other conference sessions


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Book your place today - 3 events, 2 days, 1 ticket
The must attend conference for all professionals involved within the high-end sensor market.